Welcome to ECE 215: Introduction to MEMS
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Instructor
Mona E. Zaghloul
Room 620 Phillips Hall
Phone: 202 994-3772, Fax: 202 994-0227
Email: zaghloul@gwu.edu
Lectures
In TOMP309, on Monday's from 6:10pm-8:40pm
Course Requirement
Students are required to design MEMS device, using CAD tools, and simulate the design and realize the layout of the design in the chosen technology. The students will report on their project through final project report and oral presentation. TWO students are the maximum number of students that are allowed to work on one project. Students are encouraged to design novel devices, which could be fabricated through MEMS foundries. The fabricated device may be measured in the laboratory and may be published in the literature. The proposed MEMS devices are not limited to specific area. Students are required to submit a Proposal of their chosen project by October 18 (written TWO pages). Final Project Oral and written presentation is due on Dec. 6, 2005.
Prerequisites
ECE 126 - VLSI Design and Simulation, or permission of the instructor.
Texts
In addition to class notes which are given every week, the following texts are recommended:
- G. Kovacs, Micromachined Transducers Sourcebook, McGraw-hill, 1998.
- S. Senturia: Microsystems Design, Kluwer publications, 2001
Course Outline and Schedule
September 6, 2005: Introduction to MEMS and Their Applications
Introduction to the field of Micromachined sensors and actuators .List of Course requirement. Introduction to the field and overview of the market and important applications will be discussed. Technology scaling issues. Classes of MEMS. Introducing various MEMS Computer resources at GWU.
September 13, 2005: Overview of IC Fabrication Technology
Overview of standard IC processing. CMOS technology fabricating steps
Familiarization with layout CAD tools, different layers and their notation.
Introduction to Bulk Fabrications of MEMS.
CAD tools at GWU. Start learning the Coventor Ware tutorials.
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September 20, 2005: Bulk Micromachining
Bulk micromachining is introduced that include wet and dry etch, isotropic and anisotropy etching procedures. Other techniques for bulk micromachining will be discussed. Examples of the design
Introduction to the design procedures for MEMS devices. Modeling and analytical descriptions of MEMS devices, solution of the system equations will be discussed. Use of other CAD tools will be introduced.
Continue read Coventor Tutorial. Demo of MEMS CAD tools
September 27, 2005: Introduction to Surface Micromachining
Micromachined terms, general properties of common semiconductors are discussed. Various techniques for surface micromachining will be discussed that include Thin-Film processes, electrodeposition, and sacrificial processes. List of Foundries of MEMS. Technology we will use.
Assignment #1
October 4, 2005: Mechanics of Materials and Energy Convergence
Introduction to Material Properties. Examples of energy conversion methods. Discussions of Elasticity, piezoelectricity, and piezoresisitive properties. Examples of devices will be discussed.
October 11, 2005: Examples of Mechanical Microsystems
Selective examples of the design of mechanical transducers, and of mechanical sensors
Will be introduced Mechanical resonators, accelerometers
Assignment #2
DISCUSS with the Instructor ideas for projects
October 18, 2005: Examples of Mechanical Microsystems (cont.)
Selective examples of the design of mechanical transducers, and of mechanical sensors will be introduced. Introduction to mechanical actuation, static actuators. Comb Derive design, RF-Switch
PROJECT PROPOSAL IS DUE
START project design
October 25, 2005: Electrostatic Actuation and Capacitive position sensing
Examples of capacitive sensing, circuits’ requirement for integration. Process Integration.
November 1, 2005: Example of Thermal Microsystems
Selective examples of temperature sensors and their design will be introduced. Thermal Microsystems will be discussed. Thermopiles devices.
Assignment #3
November 8, 2005: Examples of Smart Sensors
Integrated circuits with MEMS devices. Noise issues. Brief introduction to BioMEMS, and Microfluidic.
Selective examples of temperature sensors and their design will be discussed.
November 15, 2005: Integration Packaging and Assembly
Problems with process Integrations. MEMS devices packaging and assembly. Examples
November 22, 2005:
PROJECT REVIEW (Working with individual Groups)
November 29, 2005:
PROJECT REVIEW (Working with individual Groups)
December 6, 2005: Projects Are DUE
Oral presentation each student will present his/her project to the Class. Final Project Report is Due
Final Exam will be posted
Exam is Open Book and Open Notes.
Grading
| Project |
50% |
| Final Exam |
30% |
| Assignments |
20% |
University Policy on Cheating and Plagiarism
It is imperative that all graded assignments that you turn in during the course
reflect your own understanding of the material. Copying answers from another
person impedes the learning process and compromises your integrity. Students are
encouraged to discuss homework problems and laboratory assignments with others,
but submitted solutions must involve only an individual’s effort. Any student
who copies from another student’s homework, quiz, exam, report, etc., or any
student who knowingly allows another student to copy his or her work, or any
student who submits someone else’s work as his or her own, will be deemed
guilty of cheating. Cheating is an extremely serious offense. Each student
is expected to have read and understood the GWU Code of Academic Integrity
(http://www.gwu.edu/~ntegrity/code.html).
World-Wide Web Usage
Handouts, assignments, solutions, and reference materials (including class notes)
will be available on this website. Important dates and the class reading list are
available in the Syllabus section.
Warning: These materials are not a substitute for attending class regularly.
Class discussions often cover finer points of the material not included in the notes.
You are responsible for all material covered in the class whether or not it appears
on the Web.
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